Applications of the DSPC© method cover four major semiconductor product groups:
  • Integrated circuits (IC) based on Si
  • Compound semiconductor devices
  • HB-LED
  • Photovoltaics

The importance of process monitoring may differ depending on the specific applications, but in general DSPC© applications include monitoring:
  • Substrate quality
  • Contamination in cleaning, etching
  • Contamination in high temperature processes (e.g., diffusion)
  • Quality of compound semiconductor thin films including epitaxial layers
    (narrow bandgap epi on a wide bandgap substrate)
  • Characterization of  the surfaces and in particular gate insulator interfaces
Due to its novel features, the DSPC© method enables in-line monitoring using product (device) wafer structures not accessible by other in-line techniques.